4.8 (144) · $ 6.99 · In stock
At the University of Alberta, the Imaging Science Lab aims to develop vertically-integrated (VI) CMOS image sensors with capabilities that exceed those of conventional CMOS image sensors. VI-CMOS image sensors are examples of 3D electronics because they consist of photodetectors that are placed in a layer above standard CMOS circuits. Although metal lines commonly pass over transistors in CMOS image sensors, a distinguishing characteristic of VI-CMOS image sensors is the layering of semiconductor devices. The main advantage of vertical integration is that the different layers may be fabricated using different processes, each one optimized to best suit the type of devices it contains.
Flipchip bonding.
iST Latest Case Study in Flip Chip Bonding of Advanced Packaging
Challenges Grow For Creating Smaller Bumps For Flip Chips
Advanced Wire Bonding Technology: Materials, Methods, and Testing
Package Substrate, SAMSUNG ELECTRO-MECHANICS
Application Notes
Proof of concept for through silicon vias in application-specific
BJNANO - Low temperature co-fired ceramic packaging of CMOS
Challenges Grow For Creating Smaller Bumps For Flip Chips
PDF] Design and Fabrication of Bond Pads for Flip-Chip Bonding of
Bonding process of the ACF flip chip package; (a) before bonding
Wire Bonding - The Ultimate Guide Is Here - NextPCB