Schematic of the chip/bump build-up cross-section.
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Multiple System and Heterogeneous Integration with TSV-Less
pub.mdpi-res.com/chips/chips-02-00006/article_depl
Schematic of the chip/bump build-up cross-section.
High-lead flip chip bump cracking on the thin organic substrate in
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a Schematic diagram of flip-chip assembly, b flip-chip
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